Category 01
Semiconductor Equipment & Consumables
Inspection systems, processing equipment, and material-handling solutions, together with precision consumables, for every stage of semiconductor manufacturing and assembly.
AOI Inspection System
Automated optical inspection for detecting surface defects and assembly errors with high precision and throughput.
2D Laser System
High-accuracy 2D laser measurement and marking solutions for semiconductor wafer processing and component traceability.
Diama Flow — Solution Mixer
Automatically blends cleaning solution with deionized water and feeds the mixture to the dicing equipment, ensuring a stable, consistent supply of wafer-dicing cleaning fluid.
Wafer Handler
Automated wafer handling systems ensuring contamination-free transfer and positioning throughout the fab process.
OCR / Labeling System
Optical character recognition and automated labeling solutions for semiconductor product identification and traceability.
Tape & Film Attachment Machine
Precision tape and protective film application systems for wafer backgrinding and dicing preparation.
Manual Inspection Station
Ergonomically designed manual inspection workstations with integrated optical aids for quality control operations.
Semiconductor Consumables
A comprehensive range of precision consumables engineered for reliability across bond, sort, test, and assembly processes.
